onsemi is currently seeking a highly experienced senior process integration and materials expert to develop passivation materials and processes for power semiconductor devices such as SiC MOSFET, Si IGBT, and Si Diodes for the Power Solutions Group.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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onsemi is an Equal Opportunity and Affirmative Action employer. The Company maintains policies and practices that are designed to prevent discrimination or harassment against any qualified applicant or employee to the extent prohibited by federal, state and local laws and regulations. By way of example, discrimination on the basis of race (actual or perceived), ethnicity, color, religion, ancestry, national origin, citizenship, sex, age, marital status, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other characteristic protected by applicable law is prohibited.
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Requirements: Expertise in thin dielectric layers used in power semiconductor devices for inter-level isolation and die passivation, including silicon nitride and polymers. Knowledge of power semiconductor device architectures and high-voltage termination structures. Expertise in thin film deposition and coating processes. Knowledge of electrical characterization and testing of power semiconductor devices. Knowledge of reliability tests for SiC MOSFET, Si IGBT, and Si Diodes under accelerated conditions. Understanding of degradation mechanisms of semiconductor power devices. 10+ years of power semiconductor work experience including process integration and device fabrication. Excellent analytical and problem-solving skills. Capable of leveraging and reusing best practices across various technologies. Excellent interpersonal, verbal, and written communication skills, including listening, explaining, understanding, negotiating, persuading, and summarizing and presenting results. Able to work in multinational, culturally diverse, and cross-functional teams. Self-motivated, accountable, striving for continuous improvement. Master's degree and/or a PhD in Electrical Engineering, Physics, Materials Science, or related field. Key Responsibilities: Invent, innovate, and develop materials and thin films for passivation of power semiconductor devices. Develop processes for deposition of inter-level dielectric layers and passivation. Integrate the developed materials and processes into a manufacturing process flow for power devices. Explore and implement novel passivation concepts, technical improvements, and process changes. Evaluate reliability and robustness of devices with the developed passivation solutions. Identify equipment and capability requirements for new dielectric layers and deposition processes. Interface, effectively collaborate, and build strong cross-functional relationships with the Design, Process Integration, Process Engineering, and Quality Assurance teams.
