Manufacturing Test Engineer

Title: Server and Storage Manufacturing Test Engineer
Location: Hybrid onsite schedule in either SCV,CA or Austin, TX
Duration

:

12+ Months Contract on w2

Key Qualifications:
3+ years of experience in factory test and diagnostics development
Knowledge of Motherboard architecture and related subsystems such as CPU, Memory controller, Platform controller hub, BClient, DC-SCM, NVMe, HBA, HDD, OOB and OCP networking,
Linux systems engineering:
Installing RHEL/Ubuntu, compiling custom drivers into the kernel. Internal knowledge of LinuxOS, file system structure, daemons, systemd, dmesg, SEL logs.
Proficient in Unix Shell (Bash), and Python programming. Good at RegExp using sed, awk, grep ,gnu-utils, etc.
Experience with stress testing utilities, stressapp, stress-ng, iperf3, fio, memtester, etc.
Strong networking background and understanding of TCP/IP stack, 1GbE OOB Ethernet, 100GbE QSFP NICs and Switchgear. Arista EOS or Cisco IOS / Nexxus operating systems
SMBIOS, DMI, Ipmitool, bee-Client, UEFI shell and BIOS settings.
Experience programming FRU EEPROMs, contents and format
Functional understanding of open/short and in circuit testing
Ability to troubleshoot test hardware

Description of Responsibilities:
Help create as well as audit and approve Functional Test Plans and Burn-in stress testing sequences
Validate in the lab, then deliver firmware updates to the production floor.
Help design and improve production line layout and assembly stations and process
Manage production in the factory from prototype through EVT, DVT, PVT, Ramp and MP phases
Problem solve F/A reports and improve diags to maintain > 98% yield rate on high volume production lines through continuous improvement and sustaining engineering efforts.
Monitor and enforce test equipment calibration, ESD compliance, and consumable commodities (drives / cables / DIMMs, CPUs, etc.) maintenance policies.
Co-develop manufacturing instructions with ODM detailing assembly and test processes from flash programming through testing, labeling and final packaging
Requires travel to factories in Asia and North America (~25% of the time)

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