Sr. Thermal Engineer
Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that calculates using light. Transistors, the workhorse of modern computers, aren't improving at the rate they once were. To scale AI, companies are building increasingly large and energy-expensive data centers—a path that is neither financially nor environmentally sustainable. By delivering ultra-high performance and energy efficiency, Lightmatter's compute engine will power rapid advancements in AI while lowering its environmental footprint. We are inviting a Mechanical Engineer with structural analysis expertise with deep knowledge of semiconductor packaging technologies to our team.
In this role, you will be working on leading-edge packaging technologies to enable AI architectures that will set new industry standards concerning compute power, performance, and efficiency. You will be part of the package technology team and will be responsible for leading the thermal analysis required for product definitions; you will be driving innovative thermal solutions, analysis, and validation efforts to deliver package and system design that meets the product landing zone. The results of your work will lead to advanced package designs that meet power dissipation, assembly, and reliability requirements, while delivering a system-level solution for leading-edge products in the data centers and high-end compute segment.
Responsibilities
Perform thermal simulation to influence package and system design
Propose novel thermal solutions to enable Lightmatter product portfolio by investigating relevant technologies and design concepts
Drive characterization and validation of
thermal designs and electronic assemblies through lab scale prototyping and/or initiating appropriate experiments at vendors
Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
Develop automation script using Python, Matlab to improve modeling efficiency.
Write reports and document methodologies
MS or PhD in Mechanical Engineering, Material Science, or related Engineering field
3-6 years of experience in package or system thermal analysis
Deep knowledge of thermal conduction and convective heat transfer concepts
Demonstrated experience in designing, modeling, testing, sourcing, and deploying advanced thermal management technologies such as TECs, Heatpipes, Vapor Chambers, Thermal Interface Materials, Phase Change Materials, as well as Liquid and Air cooling systems.
Experience in performing steady state and transient thermal analysis using ANSYS Icepak, ANSYS Fluent and/or Flotherm
Working knowledge of lab-scale validation techniques
Preferred Qualifications:
Knowledge of 2D/3D packaging technologies and exposure to thermal challenges associated with these technologies.
Experience in the area of two-phase immersion cooling
Knowledge of thermal technologies in high-performance computing and data centers.
Develop thermal control algorithms to optimize device and system performance.
Experience with statistical analysis tools and techniques such as DOE, JMP
Excellent communication skills and ability to work well in cross-functional teams
Ability to work independently and tackle projects with minimal supervision
Ability to think creatively and solve problems quickly
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